Intel Quad-Core Xeon - Default Chapter; Table of Contents

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet 3
Contents
1 Introduction...............................................................................................................11
1.1 Terminology .....................................................................................................13
1.2 State of Data....................................................................................................15
1.3 References .......................................................................................................15
2 Electrical Specifications ...............................................................................................17
2.1 Front Side Bus and GTLREF ................................................................................17
2.2 Power and Ground Lands....................................................................................18
2.3 Decoupling Guidelines........................................................................................18
2.3.1 VCC Decoupling......................................................................................18
2.3.2 VTT Decoupling......................................................................................18
2.3.3 Front Side Bus AGTL+ Decoupling ............................................................19
2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking.......................................19
2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0])..................................20
2.4.2 PLL Power Supply................................................................................... 21
2.5 Voltage Identification (VID) ................................................................................21
2.6 Reserved, Unused, or Test Signals.......................................................................23
2.7 Front Side Bus Signal Groups..............................................................................24
2.8 CMOS Asynchronous and Open Drain Asynchronous Signals....................................26
2.9 Test Access Port (TAP) Connection.......................................................................26
2.10 Platform Environmental Control Interface (PECI) DC Specifications...........................26
2.10.1 DC Characteristics..................................................................................26
2.10.2 Input Device Hysteresis ..........................................................................27
2.11 Mixing Processors.............................................................................................. 27
2.12 Absolute Maximum and Minimum Ratings.............................................................28
2.13 Processor DC Specifications ................................................................................29
2.13.1 Flexible Motherboard Guidelines (FMB)...................................................... 29
2.13.2 VCC Overshoot Specification....................................................................42
2.13.3 Die Voltage Validation............................................................................. 43
2.14 AGTL+ FSB Specifications...................................................................................43
3 Mechanical Specifications.............................................................................................47
3.1 Package Mechanical Drawings............................................................................. 47
3.2 Processor Component Keepout Zones...................................................................51
3.3 Package Loading Specifications ........................................................................... 51
3.4 Package Handling Guidelines............................................................................... 52
3.5 Package Insertion Specifications..........................................................................52
3.6 Processor Mass Specifications .............................................................................52
3.7 Processor Materials............................................................................................52
3.8 Processor Markings............................................................................................53
3.9 Processor Land Coordinates................................................................................ 53
4 Land Listing...............................................................................................................57
4.1 Quad-Core Intel® Xeon® Processor 5300 Series Pin Assignments ........................... 57
4.1.1 Land Listing by Land Name......................................................................57
4.1.2 Land Listing by Land Number...................................................................69
5 Signal Definitions ....................................................................................................... 79
5.1 Signal Definitions ..............................................................................................79
6 Thermal Specifications ................................................................................................ 87
6.1 Package Thermal Specifications...........................................................................87
6.1.1 Thermal Specifications ............................................................................87
6.2 ......................................................................................................................95
6.2.1 Thermal Metrology .................................................................................97