Quad-Core Intel® Xeon® Processor 5300 Series Datasheet 47
Mechanical Specifications
3 Mechanical Specifications
The Quad-Core Intel® Xeon® Processor 5300 Series are packaged in a Flip Chip Land
Grid Array (FC-LGA6) package that interfaces to the baseboard via a LGA771 socket.
The package consists of two processor dies mounted on a pinless substrate with 771
lands. An integrated heat spreader (IHS) is attached to the package substrate and core
and serves as the interface for processor component thermal solutions such as a
heatsink. Figure 3-1 shows a sketch of the processor package components and how
they are assembled together. Refer to the LGA771 Socket Design Guidelines for
complete details on the LGA771 socket.
The package components shown in Figure 3-1 include the following:
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor Die
• Package Substrate
• Landside capacitors
•Package Lands
Note: This drawing is not to scale and is for reference only.
3.1 Package Mechanical Drawings
The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The
drawings include dimensions necessary to design a thermal solution for the processor
including:
• Package reference and tolerance dimensions (total height, length, width, and so
forth)
• IHS parallelism and tilt
• Land dimensions
• Top-side and back-side component keepout dimensions
• Reference datums
Note: All drawing dimensions are in mm [in.].
Figure 3-1. Processor Package Assembly Sketch
IHS
Substrate
LGA771 Socket
System Board
Capacitors
Core (die)
TIM
Package Lands
IHS
Substrate
LGA771 Socket
System Board
Capacitors
Core (die)
TIM
Package Lands
To Next Page
Loading...
Need help?
General
