Thermal Specifications
96 Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
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4. These specifications are based on silicon characterization.
5. Power specifications are defined at all VIDs found in Table 2-3. The Quad-Core Intel® Xeon® Processor
L5300 Series may be shipped under multiple VIDs for each frequency.
6. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Figure 6-5. Quad-Core Intel® Xeon® Processor L5318 Thermal Profile
Notes:
1. Please refer to Table 6-11 and Table 6-12 for discrete points that constitute the thermal profile.
2. Refer to the Quad-Core Intel® Xeon® Processor L5318 Thermal/Mechanical Design Guidelines for system
and environmental implementation details.
3. The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
4. The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances
per year, as compliant with NEBS Level 3.
5. Implementation of either thermal profile should result in virtually no TCC activation.
6. Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the
Short-Term Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the
processor’s thermal specifications and may result in permanent damage to the processor.
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