6.2 Temperature Characteristics ...................................................................................................... 63
6.3 ESD Protection ........................................................................................................................... 63
7 RF Characteristics ................................................................................... 64
7.1 Operating Band .......................................................................................................................... 64
7.2 TX Power and RX Sensitivity ..................................................................................................... 65
8 Mechanical Characteristics ...................................................................... 67
8.1 Dimensions ................................................................................................................................. 67
8.2 Label ........................................................................................................................................... 68
8.3 Packing ....................................................................................................................................... 68
8.3.1 Tray .................................................................................................................................... 68
8.3.2 Moisture ............................................................................................................................. 69
9 Mounting .................................................................................................. 70
9.1 PCB Package ............................................................................................................................. 70
9.2 Application Foot Print ................................................................................................................. 71
9.3 Stencil ......................................................................................................................................... 71
9.4 Solder Paste ............................................................................................................................... 72
9.5 SMT Oven Temperature Profile .................................................................................................. 72
Abbreviation ............................................................................................. 74
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