Neoway N723-EA - Page 73

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N723-EA Hardware User Guide

Chapter 9 Mounting

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Ramp up rate: 1 to 4 °C/sec

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Ramp down rate: -3 to -1 °C/sec

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Soaking zone: 150-180 °C, Time: 60-100 s

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Reflow zone: >220 °C, Time: 40-90 s

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Peak temperature: 235 - 245°C

For information about cautions in storage and mounting, refer to

Neoway_Reflow_Soldering_Guidelines_For_Surface-Mounted_Modules.

When manually desoldering the module, use heat guns with great opening, adjust the temperature to

245 °C (depending on the type of the solder paste), and heat the module till the solder paste is melted.

Then remove the module using tweezers. Do not shake the module at high temperatures while

removing it. Otherwise, the components inside the module might get misplaced.

Main Page

Table of Contents3
Safety Recommendations10
About N723-EA11
Product Overview11
Block Diagram11
Table 2-1 Variant and Frequency Bands11
Basic Features12
Figure 2-1 Block Diagram12
Reference Standards15
Module Pins16
Pin Layout16
Figure 4-1 N723-EA Pin Definition (Top View)16
Pin Description17
Table 4-1 Pin Description17
Table 4-2 Level Feature17
Table 4-3 Pin Description19
Application Interfaces25
Power Interface25
Vbat25
Figure 5-1 Voltage Drop of the Power Supply26
Figure 5-2 Recommended Design 126
Figure 5-3 Recommended Design 227
Figure 5-4 Recommended Design 328
Figure 5-5 Recommended Design 429
Vdd_1P830
Control Interfaces30
Pwrkey_N31
Pwrkey32
Figure 5-6 Reference Design of Startup, Shutdown, and Reset Controlled by a Button32
Figure 5-7 Reference Design of Startup, Shutdown, and Reset Controlled by an MCU32
Figure 5-8 Reference Design of Automatic Start Once Powered up33
Figure 5-9 Startup Process (by Controlling PWRKEY_N)33
Figure 5-10 Startup Process (by Controlling PWRKEY)34
Figure 5-11 Reset Process of the Module35
Usb_Boot36
Figure 5-12 Hardware Shutdown Process36
Figure 5-13 Reference Design of USB Force Download36
Sleep37
Figure 5-14 Process of Entering the Sleep Mode37
Figure 5-15 Process of Exiting from Sleep Mode38
Figure 5-16 Incoming Call Service Process38
Peripheral Interfaces39
Usb39
Figure 5-17 Outgoing Call Service Process39
Figure 5-18 Reference USB Connection Design40
Uart41
Figure 5-19 Reference Design of the UART Connection41
Figure 5-20 Recommended Level Shifting Circuit 142
Figure 5-21 Recommended Level Shifting Circuit 243
Figure 5-22 Recommended Level Shifting Circuit 344
Usim45
Figure 5-23 Reference Design of the USIM Card Interface45
Figure 5-24 Reference Design of the USIM Card (Without Hot-Swap) Interface46
Sd/Emmc47
Figure 5-25 Reference Design of the SDC Interface47
I2S48
Spi49
Figure 5-26 Reference Design of the I2S49
I2C50
Figure 5-27 SPI Reference Design50
Table 5-1 I2C Interface Parameters50
Network and Connection51
Ethernet51
Figure 5-28 Reference Design of the I2C51
Figure 5-29 Reference Design of the RMII Interface52
Sdio/Wlan53
Figure 5-30 Reference Design of the SDIO Interface with a PHY Chip53
Figure 5-31 SDIO Reference Design54
GPIO Interfaces55
RF Interface55
ANT_MAIN/ANT_DIV Antenna Interfaces55
Figure 5-32 L-Type Network56
Figure 5-33 T-Type Network56
Figure 5-34 Π-Type Network56
Antenna Assembling57
Figure 5-35 Recommended RF PCB Design57
Figure 5-36 Murata RF Connector Encapsulation Specifications58
Figure 5-37 RF Cable Connections58
Figure 5-38 Antenna Layout59
Figure 5-39 Layout Around the Antenna59
Multi-Function Interfaces60
Other Interfaces60
Ring60
Figure 5-40 Pulse Wave for an Incoming Call60
Table 5-2 Pin Definition Description60
Net_Light61
Figure 5-41 RING Indicator for SMS61
Figure 5-42 Driving LED with a Triode61
Electrical Characteristics and Reliability62
Electrical Characteristics62
Table 6-1 N723-Eaelectrical Characteristics62
Table 6-2 N723-EA Current Consumption (Typical)62
Temperature Characteristics63
ESD Protection63
Table 6-3 N723-EA Temperature Features63
Table 6-4 N723-EA ESD Protection Features63
RF Characteristics64
Operating Band64
Table 7-1 N723-EA Operating Bands64
TX Power and RX Sensitivity65
Table 7-2 N723-EA RF Transmit Power65
Table 7-3 GSM RX Sensitivity of N723-EA65
Table 7-4 N723-EA WCDMA RX Sensitivity65
Table 7-5 LTE RX Sensitivity of N723-EA66
Mechanical Characteristics67
Dimensions67
Figure 8-1 N723-EA Dimensions (Unit: MM)67
Label68
Packing68
Tray68
Figure 8-2 N723-EA Label68
Moisture69
Figure 8-3 Packing Process69
Mounting70
PCB Package70
Figure 9-1 N723-EA Bottom View of PCB Package (Unit: MM)70
Application Foot Print71
Stencil71
Figure 9-2 N723-EA Recommended Footprint of the Pplication PCB (Unit: MM)71
Solder Paste72
SMT Oven Temperature Profile72
Figure 9-3 Oven Temperature Profile72
Abbreviation74

Neoway N723-EA - Page 73

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