•
SIM card interface
•
Stereo audio codecs and amplifiers
•
A/D converter
•
Regulators
•
Vibra interface
•
Digital interface (CBUS)
EMC ASIP (Appcation Specified Integrated Passive) have been integrated inside the ASIC. It includes biasing
passives for microphone , EMC filter for SIM, microphones etc.
Device memories
Combo memory
The memory of the device consists of stacked DDR SDRAM and MuxedMassMemory (M3). Combo memory DDR/
M3 memory has 1Gb DDR + 2Gb M3.
Audio concept
Audio HW architecture
The functional core of the audio hardware is built around three ASICs: RAPIDOYAWE engine ASIC, mixed signal
ASIC Avilma and D/A converter DAC33.
DAC33 converts digital audio signal to analog and is routed to the FM Transmitter and amplifier TPA6130
which provides an interface for the transducers and the accessory connector.
AVilma provides analog signal for earpiece and for D-class audio amplifier TPA2012D2, which drives
integrated stereo handsfree speakers.
There are four audio transducers:
•
5x10 mm dynamic earpiece
•
Two 8x12 mm dynamic speakers
•
Digital microphone
Avilma provides an output for the dynamic vibra component. All wired audio accessories are connected to
the AV accessory connector. A Bluetooth audio and FM radio module, which is connected to RAPIDOYAWE,
supports Bluetooth audio and FM radio functionality.
RM-505; RM-506
System Module and User Interface
Page 8 –32 COMPANY CONFIDENTIAL Issue 1
Copyright © 2009 Nokia. All rights reserved.
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