Quectel EG25-G - Page 29

LTE Module Series
EG25-G Hardware Design
EG25-G_Hardware_Design 28 / 100
SGMII_RX_M
126
AI
SGMII receiving
- minus
If unused, keep it
open.
USIM2_VDD
128
PO
SGMII MDIO pull-up
power source
1.8V/2.85V
configurable.
If unused, keep it
open.
RF Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ANT_DIV
35
AI
Diversity antenna
50Ω impedance
If unused, keep it
open.
ANT_MAIN
49
IO
Main antenna
50Ω impedance
ANT_GNSS
47
AI
GNSS antenna
50Ω impedance
If unused, keep it
open.
GPIO Pins
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
WAKEUP_IN
1
DI
Sleep mode control
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
Cannot be pulled up
before startup.
Low level wakes up
the module.
If unused, keep it
open.
W_DISABLE#
4
DI
Airplane mode
control
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
Pull-up by default.
In low voltage level,
module can enter into
airplane mode.
If unused, keep it
open.
AP_READY
2
DI
Application
processor sleep
state detection
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
If unused, keep it
open.
USB_BOOT Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
USB_BOOT
115
DI
Force the module to
enter into
emergency
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
1.8V power domain.
Active high.
It is recommended to