1.4.4 Use of Thermal Compound Paste (Only for Cold Plate Models)
To use the thermal compound paste, the surface of heatsink and cold plate must
be free from dust, dirt, oil and particles.
In addition, the heatsink surface must meet the following three conditions:
● Minimum surface flatness: 50 µm (DIN EN ISO 1101)
● Maximum surface roughness: 6 µm (DIN EN ISO 4287)
● Maximum peak-valley height of the surface: 10 µm (DIN EN ISO 4287)
It is recommended to use P12 thermal compound paste from Wacker
Chemie. It should be applied evenly. The maximum thickness is 100
μm.
After the use of thermal paste, tighten four M4 fastening screws by following
procedure.
1. Fix the screws with 0.5 Nm (hand tight, crosswise) in the sequence:
1 -> 2 -> 3 -> 4
Fig. 1-10: Tightening sequence to mount the module to the heatsink
2. Tighten the screws with 2.0...2.5 Nm in the same sequence (crosswise):
1 -> 2 -> 3 -> 4
Tighten the screws with specified torques. Failure to do so, may in-
hibit drive cooling and cause possible damage to the drive.
Bosch Rexroth AG
Mechanical Installation
EFC 3610 / EFC 5610
10/87
DOK-RCON03-EFC-X610***-QU11-EN-P
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