Service Manual
Reference Information
12-4
Samsung Electronics
PMO-CAM JAM REMOVE PMO-CAM= Processing Mold-CAM
PMO-LOCKER DEVE DEVE=Developer
SPECIAL SCREW(PANNEL MFP) MFP =Multi-Functional Peripheral
A/S MATERAL-DUMMY UPPER ASS’Y A/S=After-Service
MCT-GLASS ADF MCT= Machinery Cutting
ADF=Automatic Document Feeder
PPR-REGISTRATION EDGE(F) PPR= Processing Press
IPR-HOLDER GLASSI PR=Iron Press
MCT-GLASS SCANNER(LEGAL) MCT= Machinery Cutting
CBF HARNESS-OPE OPE=Operation Panel(Control Panel)
PBA SUB-D_SUB PBA SUB-D_SUB =>Sub Printed circuit Board
Assembly for the D-SUB type electrical connector
(D-Sub) a kind of the connector type(shape ‘D’)
COVER-M-CCD CABLE M=Mold
CCD=Charge Coupled Device
COVER-SCAN LOWER(UMAX) UMAX=> Supplier’s name for CCD module
ICT-INSERT SHAFTI ICT= Iron Cutting
IPR-BRK SCAN BD IPR=Iron Press
BRK=Bracket
BD= Board
CBF SIGNAL-CCD FFC CCD = Charge Coupled Device
FFC =Flexible Flat Cable
COVER-M-OPE M=Mold
OPE=Operation Panel(Control Panel)
KEY-M-COPY M=Mold
PLATE-M-ALPHA KEY M=Molde
ALPHA=Alphabet
PMO-GUIDE DP SIDE DP=Duplex
RING-CS CS= Compress
GEAR-MP/DUP DRV MP =Multi-Purpose (Bypass) tray
DUP DRV = Duplex Driver
IPR-BRKT G DUPI PR=Iron Press
BRKT=BRACKET
G= Ground
DUP=Duplex
PMO-BUSHING TX(B4) TX=Transmit
PMO-TRAY CASE, MP MP=Multi-Purpose tray(Bypass tray)
ACRONYM EXPLANATION
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