Sony RM-PJ25 - Packing Materials & Supplied Accessories

3-36
VPL-HW40ES
---------
QB BOARD
---------
Ref. No.
or Q'ty Part No. SP Description
1pc A-1512-876-A s MOUNTED CIRCUIT BOARD, QB
C90 1-162-964-91 s CAP,CHIP CERAMIC 1000PF B 1608
C91 1-162-964-91 s CAP,CHIP CERAMIC 1000PF B 1608
C92 1-162-964-91 s CAP,CHIP CERAMIC 1000PF B 1608
C93 1-162-964-91 s CAP,CHIP CERAMIC 1000PF B 1608
CN90 1-565-269-12 s SOCKET, CONNECTOR (D-SUB,L) 9P
CN91 1-820-181-11 s HEADER ASSEMBLY (PRINT PWB) 4P
R90 1-216-809-91 s RES, CHIP 100 (1608)
---------
TL BOARD
---------
Ref. No.
or Q'ty Part No. SP Description
1pc A-1512-878-A s MOUNTED CIRCUIT BOARD, TL
C60 1-114-325-11 s CAP, CERAMIC 0.1MF X7R 1608
CN60 1-820-298-11 o HEADER ASSEMBLY (PRINT PWB) 4P
TH60 1-804-045-11 s THERMISTOR
--------
U BOARD
--------
Ref. No.
or Q'ty Part No. SP Description
1pc A-1512-879-A s MOUNTED CIRCUIT BOARD, U
CN70 1-820-297-11 o HEADER ASSEMBLY (PRINT PWB) 3P
S70 1-570-504-12 s SWITCH, MICRO
--------
V BOARD
--------
Ref. No.
or Q'ty Part No. SP Description
1pc A-1512-880-A s MOUNTED CIRCUIT BOARD, V
C50 1-114-325-11 s CAP, CERAMIC 0.1MF X7R 1608
CN80 1-820-298-11 o HEADER ASSEMBLY (PRINT PWB) 4P
S80 1-570-504-12 s SWITCH, MICRO
TH50 1-804-045-11 s THERMISTOR
3-4. Packing Materials & Supplied
Accessories
----------------------------------------
PACKING MATERIALS & SUPPLIED ACCESSORIES
----------------------------------------
*a:[VPL-HW40ES (SY)]
*b:[VPL-HW40ES (U)]
*c:[VPL-HW40ES (CN)]
Ref. No.
or Q'ty Part No. SP Description
1pc 1-492-861-11 s REMOTE COMMANDER (RM-PJ25)
1pc 9-885-120-26 s COVER, BATTERY (For RM-PJ25)
1pc *b
! 1-534-827-15 s CORD, POWER (For U)
1pc *c ! 1-833-005-31 s AC POWER-SUPPLY CORD (For CN)
1pc *a*b 4-534-760-01 s PACK, CD-ROM
OPERATING INSTRUCTIONS
(ENGLISH, FRENCH, GERMAN, ITALIAN,
SPANISH, RUSSIAN)
1pc *c 4-535-730-01 s MANUAL, INSTRUCTION
(SIMPLIFIED CHINESE)