LE910Cx Hardware Design Guide
1VV0301298 Rev.40 Page 106 of 149 2023-03-16
Not Subject to NDA
Warning: The above solder reflow profile represents the typical SAC
reflow limits and does not guarantee adequate adherence of the
module to the customer application throughout the temperature
range. Customer must optimize the reflow profile depending on the
overall system taking into account such factors as thermal mass and
warpage
Profile Feature Pb-Free Assembly
Average ramp-up rate (TL to TP) 3°C/second max
Preheat
– Temperature min (Tsmin)
– Temperature max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak temperature (Tp) 245 +0/-5°C
Time within 5°C of actual peak
Temperature (tp)
10-30 seconds
Ramp-down rate 6°C/second max
Time 25°C to peak temperature 8 minutes max
Table 44: Solder Profile Characteristics
Note: All temperatures refer to the top side of the package,
measured on the package body surface.
Warning: The LE910Cx module withstands one reflow process only.
10.7.2. Cleaning
In general, cleaning the module mounted on the carrier board is not recommended.
Residues between the module and the host board cannot be easily removed with
any cleaning method.
To Next Page
Loading...
Need help?
General
