Texas Instruments LDC1101EVM - EVM Design - Board Layout; Top Layer Routing; MID-Layer 1 Routing

Chapter 4
SNOU137–May 2015
EVM Design - Board Layout
Layer Usage
Layer Functionality
Top Signals, Components, and ground-fill
Mid-layer 1 Ground
Mid-layer 2 Signals and section transition routing
Bottom MSP430 Power and optional components
Figure 4-1. Top Layer Routing
Figure 4-2. Mid-Layer 1 Routing
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EVM Design - Board Layout SNOU137–May 2015
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