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Thermal Arc ARCMASTER 400TS - Verification of the Secondary Diode (D2-D7); Verification of the Primary IGBT (Q1-Q24)

Thermal Arc ARCMASTER 400TS
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300/400TS and 300/400S 11 ADVANCED TROUBLESHOOTING
11 – 15
5.6 Verification of the secondary
Diode (D2-D7)
CAUTION
Before performing any portion of the procedure
below, make certain the unit is placed in the initial
set up condition as described in section 11.4.1
"Preparation".
1) Verify the characteristic of the secondary
diode, D2-D7, using a diode tester.
2) Refer
to Table 11-6 and Figure 11-15 for
the checkpoints on D2-D7.
Table11-6: Tester checkpoints for D2-D7
Figure 11-15: Tester checkpoints in the D2-D7
5.7 Verification of the primary
IGBT (Q1-Q24)
CAUTION
Before performing any portion of the procedure
below, make certain the unit is placed in the initial
set up condition as described in section 11.4.1
"Preparation".
1) Check whether there are any abnormalities in
the appearance of PCB8-PCB11.
2) Verify the characteristic of the primary IGBT
(Q1-Q24), using a diode tester.
3) Refer to T
able 11-7 and Figure 11-16 for
the ch
eckpoints on PCB8-PCB11.
Table11-7: Tester checkpoints in the Q1-Q24
Figure 11-16: Tester checkpoints for Q1-Q24
COMPONENT
TESTED
TERMINALS
ACCEPTABLE
VALUE
Positive
lead
Negative
lead
Diode 1 of
D2-D7
Anode
Cathode
Cathode
Anode
0.2 to 0.3V
Open
Diode 2 of
D2-D7
Anode
Cathode
Cathode
Anode
0.2 to 0.3V
Open
D2
D4
D7
D5
Anode
Diode 1 Diode 2
Anode
Cathode
Cathode
COMPONENT
TESTED
TERMINALS
ACCEPTABLE
VALUE
Positive
lead
Negative
lead
Collector-Emitter
of Q1∼Q12 with
PCB8 and PCB9
C
CE
CE
C
Open
0.2 to 0.5V
Collector-Emitter
of Q13∼Q24 with
PCB10 and PCB11
CE
E
E
CE
Open
0.2 to 0.5V
TRO_0031
C CE E
TRO_0031
C CE E
PCB10
PCB11
PCB8
PCB9
C CE E

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