10 Reference Information
Product Manual, Control Cabinet IRC5P 3HNA009834-001 en Rev.06 215
10.3 Bonding Information
Hints • You may check that the bonding is good by using an oscilloscope with an EMI
probe (Electro Magnetic Interference). By setting the oscilloscope to a relatively
high frequency and measuring on the screens and chassis of the different units in
the system, possible noise can be seen on the oscilloscope screen.
• If noise is present in the situations shown in Figure 90 example 2 and 3, a
ceramic capacitor of e.g. 0.22µF can be installed between the screen and chassis
as shown in example 3.
• Cables of different types such as signal cables and power cables must not be
routed together as the power cables may introduce noise in the signal cable.
• If the bonding has been performed according to the general guidelines given here
but noise is still present, there is a good chance that the bonding wire used are of
too small square in relation to the length of the wire or that the connections
between the bonding wire and/or screens are not good enough.
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