APPENDIX E: GUIDELINES FOR REFLOW SOLDERING
UNIFLOW
®
4 PULSED HEAT CONTROL
E-12 990-908
Conclusion
Pulse heated thermode reflow soldering of flex to PCB is a stable and well controlled process if certain
basic design guide rules are followed. These rules differ from the rules that apply to conventional
soldering processes. The process window can be made substantially wider by a joint design that
promotes easy and equal heat generation. Even more by a design that accommodates the flow of solder
and can compensate for variations in the prior processing steps.
Good joint design and repeatable fine control over solder quantities are the keys to production success.
The growing need for product miniaturization and reduced weight are major drivers increasing the use
of flexible circuit technology with the electronic industry. Today’s control over the thermode soldering
process offers a production oriented, reliable solution to the interconnection demands of this growing
market.
To Next Page
Loading...