CHAPTER 3: USING PROGRAMMING FUNCTIONS
UNIFLOW
®
4 PULSED HEAT CONTROL
3-4 990-908
You can include a process cycle in a
Profile by assigning the desired process
cycle a time of greater than 0 seconds.
The Control requires that every Profile
has at least one process cycle, Reflow,
with a time of at least 0.1 seconds.
Base
You can use Baseheat to provide a consistent temperature starting point for the process. The
temperature for this state is displayed as 60C (note the Celsius units at the right hand side of the screen)
and time as 01.0 seconds (note the seconds units at the right hand side of the screen. Baseheat can be
set from 25° to 300°C and 0 to 99.9 seconds. When it is set to 00.0 seconds, the Baseheat state is
omitted.
Rise1
You can use Rise1 to reduce the temperature overshoot at the beginning of Preheat. Rise1 is shown as
being set for 1.0 seconds. It can be set from 0 to 9.9 seconds. When it is set to 0.0 seconds, the Rise1
state is omitted.
Preheat
You can use Preheat to activate flux for removing solder oxides between solder plated parts. You can
also use Preheat to reduce warping on large thermodes by decreasing the temperature difference
between Preheat and Reflow periods.
The temperature for this state is displayed as 150C and the time is 01.0 seconds.
Preheat can be set
from 60° to 500°C and from 0 to 99.9 seconds. When it is set to 00.0 seconds, the
Preheat state is
omitted from the heat profile.
Rise2
You use
Rise2 to reduce the thermode warping caused by rapidly heating from the Preheat setting to the
Reflow setting. Rise2 is shown as being set for 2.0 seconds. It can be set from 0 to 9.9 seconds. When it
is set to 0.0 seconds, the Rise2 state is omitted.
Reflow
You use the
Reflow period to actually melt the solder for a reflow solder joint, or set thermoplastic or
thermoset conductive adhesives for a heat-seal joint.
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