CHAPTER 3: USING PROGRAMMING FUNCTIONS
UNIFLOW
®
4 PULSED HEAT CONTROL
3-20 990-908
SETUP Key
This key brings up the
SETUP MENU screen.
The SETUP MENU screen provides a
menu of operating characteristics for the
Control.
< SETUP MENU >
1. HARDWARE SETUP
2. COMMUNICATIONS
3. REFLOW SETUP
4. SYSTEM SECURITY
5. COPY PROFILE
6. SET TO DEFAULTS
7. LANGUAGE
8. I/O STATUS
Number Select an item, Graph / Data
HARDWARE SETUP
Pressing 1 with the SETUP MENU screen
displayed will bring up the HARDWARE
SETUP
screen.
< HARDWARE SETUP
1. HEAD COOL VALVE IS : OFF
2. SOLDER COOL VALVE IS : OFF
3. FOOTSWITCH RESPONSE MODE : ABORT
4. LIST OF HARDWARE
5. BACKLIGHT OPERATION : ON
6. BUZZER LOUDNESS : 50%
7. END OF CYCLE BUZZER : ON
8. SET OUTPUT RELAYS
Number Select, Page, Graph / Data
HEAD COOL VALVE IS
Press the 1 key to toggle between OFF and ON. Selecting ON continuously activates the head cool
valve, which supplies drive power for a user-supplied air solenoid valve. The drive power is
connector-selectable at either 24 VAC or +24 VDC
NOTE: If Idle Heat is turned ON, the head cool valve is automatically turned on. This valve
controls air to cool a hot thermode holder on a reflow solder or heat seal head. See Appendix B,
Electrical and Data Connections for connection details.
SOLDER COOL VALVE IS
Press the 2 key to toggle between OFF and ON. If the Profile does not have a Postheat process cycle,
selecting
ON will activate the solder cool valve starting at the end of the Reflow period and de-
activating when the thermode reaches either the COOL1, PREHEAT, or BASE temperature which ever
is lower. If the Profile does have a Postheat process cycle, selecting ON will activate the solder cool
valve starting at the end of the Reflow period and de-activate the valve when the thermode reaches
the
COOL1 temperature.
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