1-3
GF Series
Installation and Operation Manual
X-TMF-GF Series-MFC-eng
Part Number: 541B137AAG
March, 2010
Section 1 Introduction
1-9 Glossary of Terms and Acronyms
Term or Acronym Definition
CSR Customer Special Requirement
CVD Chemical Vapor Deposition
DeviceNet A 5-wire local network I/O communication device
that employs a command/response
communication protocol
DSP Digital Signal Processor
EPI Epitaxy (EPI). A process technology where a pure silicon
crystalline structure is deposited or “grown” on a
bare wafer, enabling a high-purity starting point
for building the semiconductor device.
HBD Horizontal Base Down
GF1XX Integrated Flow Controller
F.S. Full Scale
LED Light Emitting Diode
MFC Mass Flow Controller
MultiFlo Configurator I/O communication software package that
configures gas and flow ranges
MultiFlo Technology A physics-based calibration methodology that
enables gas and flow range configuration within
a defined standard configuration
PID Proportional Integral Derivative Controller
PSIA Pounds per Square Inch Absolute
PSID Pounds per Square Inch Differential
PSIG Pounds per Square Inch Gauge
PTI Pressure Transient Insensitive. Reduces the
effect of pressure fluctuations in gas flow.
Applicable to GF125 only.
ROR As pressure increases, flow increases at a
pressure rate of rise, or ROR.
HC Standard Configuration w/ Hastelloy® sensors
(to reduce reaction to corrosive gases)
S.P. Setpoint
Step Technology Enables fast set point control through a high
speed DSP and low volume drive circuit
VIU Vertical mounting attitude with inlet side facing up
Table 1-1 Terms and Acronyms