There are two basic types of maintenance: preventive and corrective.
Preventive maintenance is a periodic check of the system to keep it functioning at peak performance. Preventive
maintenance can also help prevent breakdowns and equipment outages by identifying potential problems before
they become real problems.
Corrective maintenance refers to fixing a problem once it has occurred. The goal of corrective maintenance is to
get the system back on line as quickly as possible with a minimum impact on operations.
Any maintenance philosophy needs to encompass the entire system with the major components being the power
supply, the receiver/decoder, the controller and the antenna. A failure of any of these components prevents the
entire system from functioning. As a result, the maintenance program needs to include all of these components.
7.2 Corrective Maintenance
When performing corrective maintenance, observe the following guidelines:
• Tag all leads prior to desoldering or removal from a terminal board. Use small wire tags or pieces
of adhesive tape with handwritten numbers. Reconnect all wires to the same location from which
they were removed
Note: Microprocessor devices, as used in Cattron PRC systems, use programmable EPROMs for
program storage. Proper part numbers, version numbers and, in some cases, revision numbers
must be used when installing spare circuit boards.
• Replace damaged or defective parts with identical parts. If it is necessary to use substitute parts,
replace them with the correct part as soon as possible. The substitute part must have identical
electrical properties
• Relocation of any part may result in a hum or other interference. Relocation of parts is not
recommended
• Before soldering any connections, carefully scrape all parts that will be touched by solder until all
rust, corrosion, paint and/or varnish are removed. Dust the parts with a small, clean brush. Tin all
surfaces to be soldered. Wrap the wire around the lug for a good mechanical connection and
support prior to soldering. Solder the connection using a minimum of solder with sufficient heat to
make the solder flow evenly around the tinned surface
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