8.3 Production Welding
The C16QS module is packaged in an anti-static tray. The SMT wire body needs to be equipped with a Tray
module. It is recommended to use a reflow oven above 7 temperature zones.
✓ To ensure the quality of the module paste, the thickness of the stencil corresponding to the pad portion
of the C16QSmodule is recommended to be 0.18 mm.
✓ The recommended reflow temperature is 235~245oC, which cannot exceed 260oC.
✓ When the PCB is laid out on both sides, the LGA module layout must be machined on the 2nd side. Avoid
module falling parts, welding and welding, and poor internal welding of the module caused by the gravity
of the module.
The recommended furnace temperature curve is shown below:
Figure 33 Reflow soldering temperature graph
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