Dell EMC FS25 - Transferring Components

Figure 26 Securing the front of the enclosure
CL4725
Transferring components from the faulted DAE to the
replacement DAE
Use the procedures in this section to transfer each power/cooling module, link control cards
(LCCs), disk, and disk filler module from the faulted DAE to the corresponding locations in the
replacement DAE.
To help ensure the correct placement in the enclosure:
l
Transfer one component at a time.
l
When transferring a power/cooling module or LCC:
Always move a component from position A (faulted) to position A (replacement), or B to B; do
not move A to B or B to A.
n
Move components from position A of the faulted DAE to position A of the replacement
DAE.
n
Move components from position B of the faulted DAE to position B of the replacement
DAE.
l
Transfer each disk and disk filler module to the SAME SLOT LOCATION that it occupied in
faulted DAE.
Removing a power/cooling module
Procedure
1.
Press the orange handle button to release the module.
2. Pull the latch outward and remove the power/cooling module from its slot.
Replacing a 25-Slot Disk-Array Enclosure
38 Dell EMC FS25 SSD Shelf Guide Field Replacement Unit Guide