Dell EMC PowerEdge R7525 - GPU;FPGA Thermal Restriction Matrix; Processor and Heat Sink Matrix

Table 80. Thermal restriction matrix (continued)
Configuration
8 x 2.5-
inch
NVMe
16 x 2.5-
inch
SAS
16 x 2.5-
inch
NVMe
16 x 2.5-
inch
SAS + 8
x 2.5-
inch
NVMe
24 x 2.5-
inch
NVMe
8 x 3.5-
inch
12 x 3.5-inch
Ambient
temperatu
re
Rear storage
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
2 x Rear
2.5-inch
No Rear
Fan
" and
24x2.5
"
chassi
s have
30°C
limitat
ion.
NOTE: Three fan modules are required for single processor, and six fan modules are required for dual processor system.
NOTE: If the DIMM is 128 GB and above in a12 x 3.5-inch chassis with CPU TDP/cTDP is greater than 200 W or 12 x 3.5"
+ x2 rear-drive chassis with CPU TDP/cTDP greater than 170 W.
Table 81. GPU/FPGA thermal restriction matrix
Configura
tion
(Front
storage)
Fan type
Max CPU
TDP/cTDP
GPU/FPGA ( Ambient temperature )
T4
V100 (16
GB)
V100S M10
Snow
white
RTX 6000 RTX8000
No
Backpane
HPR 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C
8 x 2.5-
inch
NVMe
HPR 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C
16 x 2.5-
inch SAS
HPR 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C
16 x 2.5-
inch
NVMe
VHP 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C
16 x 2.5-
inch SAS
+ 8 x 2.5-
inch
NVMe
VHP 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C
8 x 3.5-
inch SAS
HPR 280 W 30°C 35°C 30°C 35°C 35°C 35°C 35°C
NOTE: GPU is not supported in 12 x 3.5-inch hard drive and 24 x 2.5-inch NVMe configuration systems.
NOTE: Low Profile and Full Height T4 cards are installed in order to support maximun 6 pcs T4 in x 16 slots.
Table 82. Processor and heat sink matrix
Heat sink Processor TDP
STD HSK < 180 W
Technical specifications 195