ETERNUS DX500 S5/DX600 S5
The table below shows whether hot swap or hot expansion for components of the ETERNUS DX500 S5/DX600 S5
is possible.
Table 114 Hot Swap and Hot Expansion Availability for Components (ETERNUS DX500 S5/DX600 S5)
Component Hot swap Hot expansion Remarks
Controller enclosure (CE) Components can be individually
replaced.
Controller module (CM)
¡ (*1)
— —
System memory
¡ (*1) ¡ (*2)
—
BUD (*3)
¡ (*1)
— —
Controller firmware
¡ (*1) (*4)
— Make sure to stop I/Os before
implementation in a Unified
configuration.
PCIe Flash Module (PFM)
¡ ¡
—
Host interface (FC-CA)
¡ ¡
—
Host interface (10G iSCSI-CA)
¡ ¡
—
Host interface (1G iSCSI-CA)
¡ ¡
—
Host interface (10G Ethernet-CA)
¡ ¡
—
Host interface (1G Ethernet-CA)
¡ ¡
—
Power supply unit for CE (CPSU)
¡
— —
MP (*5)
´
— —
Disk (HDD)
¡ ¡
—
SSD
¡ ¡
—
Operation panel (PANEL)
¡
— —
Battery Backup Unit (BBU)
¡
— —
Battery Charger Unit (BCU)
¡
— —
Battery Unit (BTU)
¡
— —
Disk firmware
¡ (*4)
— —
Drive enclosure (DE)/high-density drive enclosure (HD-
DE)
¡ ¡
Replace the drive enclosure (DE)/
high-density drive enclosure (HD-DE)
when the MP (*5) fails.
Power supply unit for DE (PSU)
¡
— —
Disk (HDD)
¡ ¡
—
SSD
¡ ¡
—
Operation panel (PANEL)
´ (*6)
— —
I/O module (IOM)
¡
— —
Fan Expander Module (FEM) (*7)
¡
— —
Disk firmware
¡ (*4)
— —
¡: Allowed / ´: Not allowed (cold swap is possible) /
—: Not applicable
*1: All of the host interfaces on the CM that will have maintenance performed go offline. When a multipath configuration is used, switch to
the host paths of the CM that will not have maintenance performed to continue operation.
*2: When hot expanded, each CM must be pulled out to expand. Therefore, all host interfaces on the CM to be expanded will temporarily go
offline.
7. Maintenance/Expansion
Hot Swap/Hot Expansion
305 Design Guide