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HP Z8 G4 Maintenance And Service Guide

HP Z8 G4
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Preventing electrostatic damage to equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent damage to electric
components and accessories.
To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
Protect all electrostatic-sensitive parts and assemblies with conductive or approved containers
or packaging.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
Place items on a grounded surface before removing them from their containers.
Always be properly grounded when touching a sensitive component or assembly.
Avoid contact with pins, leads, or circuitry.
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or conductive foam.
Personal grounding methods and equipment
Use the following equipment to prevent static electricity damage to equipment:
Wrist straps are exible straps with a maximum of one-megohm ± 10% resistance in the ground cords. To
provide proper ground, a strap must be worn snugly against bare skin. The ground cord must be connected
to the banana plug connector on the grounding mat or workstation and t snugly into it.
Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible with most
types of shoes or boots. On conductive oors or dissipative oor mats, use them on both feet with a
maximum of one-megohm ± 10% resistance between the operator and ground.
Static Shielding Protection Levels
Method Voltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
1,500
7,500
15,000
Grounding the work area
To prevent static damage at the work area, observe the following precautions:
Cover the work surface with approved static-dissipative material. Provide a wrist strap connected to
the work surface and use properly grounded tools and equipment.
Use static-dissipative mats, foot straps, or air ionizers to give added protection.
Handle electrostatic-sensitive components, parts, and assemblies by the case or PCB laminate. Handle
them only at static-free work areas.
Turn o power and input signals before inserting and removing connectors or test equipment.
Use xtures made of static-safe materials when xtures must directly contact dissipative surfaces.
Keep work area free of nonconductive materials such as ordinary plastic assembly aids and Styrofoam.
Use eld service tools, such as cutters, screwdrivers, and vacuums, that are conductive.
Electrostatic discharge information 11

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HP Z8 G4 Specifications

General IconGeneral
Display includedNo
Keyboard includedYes
Power supply1125 W
Operating system architecture64-bit
Audio chipRealtek ALC221
Product typeWorkstation
Market positioningBusiness
Motherboard chipsetIntel C622
Chassis typeTower
Product colorBlack
Country of originChina
Number of 3.5\" bays4
Number of 5.25\" bays2
PCI Express x8 slots3
Headphone outputs1
HDMI ports quantity0
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity8
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integrated-
Total storage capacity1000 GB
Memory slots24x DIMM
Internal memory8 GB
Memory channelsHepta-channel
Memory clock speed2666 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory- GB
Memory layout (slots x size)1 x 8 GB
Tcase77 °C
SteppingU0
Processor cache11 MB
Processor model4108
System bus rate- GT/s
Processor socketLGA 3647 (Socket P)
Processor threads16
Processor codenameSkylake
Processor frequency1.8 GHz
Processor cache typeL3
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3 GHz
Thermal Design Power (TDP)85 W
Maximum number of PCI Express lanes48
Memory clock speeds supported by processor2400 MHz
Maximum internal memory supported by processor768 GB
Scalability2S
Processor codeSR3GJ
Processor ARK ID123544
Intel TSX-NI version1.00
Processor package size76.0 x 56.5 mm
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Weight and Dimensions IconWeight and Dimensions
Depth551.2 mm
Width215.9 mm
Height444.5 mm
Weight22400 g

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