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HP Z8 G4 Maintenance And Service Guide

HP Z8 G4
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Cables and connectors
Most cables used throughout the unit are at, exible cables. These cables must be handled with care to avoid
damage. Apply only the tension required to seat or unseat the cables during insertion or removal from
the connector. Handle cables by the connector whenever possible. In all cases, avoid bending or twisting
the cables, and ensure that the cables are routed in such a way that they cannot be caught or snagged by parts
being removed or replaced.
CAUTION: When servicing this computer, ensure that cables are placed in their proper location during
the reassembly process. Improper cable placement can damage the computer.
Hard Drives
Handle hard drives as delicate, precision components, avoiding all physical shock and vibration. This applies to
failed drives as well as replacement spares.
If a drive must be mailed, place the drive in a bubble-pack mailer or other suitable protective packaging and
label the package “Fragile: Handle With Care.”
Do not remove hard drives from the shipping package for storage. Keep hard drives in their protective
packaging until they are actually mounted in the computer.
Avoid dropping drives from any height onto any surface.
If you are inserting or removing a hard drive, turn o the computer. Do not remove a hard drive while
the computer is on or in standby mode.
Before handling a drive, ensure that you are discharged of static electricity. While handling a drive, avoid
touching the connector.
Do not use excessive force when inserting a drive.
Avoid exposing a hard drive to liquids, temperature extremes, or products that have magnetic elds such
as monitors or speakers.
Lithium coin cell battery
The battery that comes with the computer provides power to the real-time clock and has a minimum lifetime of
about three years.
See the appropriate removal and replacement chapter for the chassis you are working on in this guide for
instructions on the replacement procedures.
WARNING! This computer contains a lithium battery. There is a risk of re and chemical burn if the battery is
handled improperly. Do not disassemble, crush, puncture, short external contacts, dispose in water or re, or
expose it to temperatures higher than 140ºF (60ºC). Do not attempt to recharge the battery.
NOTE: Batteries, battery packs, and accumulators should not be disposed of together with general household
waste. In order to forward them for recycling or proper disposal, please use the public collection system or
return them to HP.
Service considerations 15

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HP Z8 G4 Specifications

General IconGeneral
Display includedNo
Keyboard includedYes
Power supply1125 W
Operating system architecture64-bit
Audio chipRealtek ALC221
Product typeWorkstation
Market positioningBusiness
Motherboard chipsetIntel C622
Chassis typeTower
Product colorBlack
Country of originChina
Number of 3.5\" bays4
Number of 5.25\" bays2
PCI Express x8 slots3
Headphone outputs1
HDMI ports quantity0
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity8
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integrated-
Total storage capacity1000 GB
Memory slots24x DIMM
Internal memory8 GB
Memory channelsHepta-channel
Memory clock speed2666 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory- GB
Memory layout (slots x size)1 x 8 GB
Tcase77 °C
SteppingU0
Processor cache11 MB
Processor model4108
System bus rate- GT/s
Processor socketLGA 3647 (Socket P)
Processor threads16
Processor codenameSkylake
Processor frequency1.8 GHz
Processor cache typeL3
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3 GHz
Thermal Design Power (TDP)85 W
Maximum number of PCI Express lanes48
Memory clock speeds supported by processor2400 MHz
Maximum internal memory supported by processor768 GB
Scalability2S
Processor codeSR3GJ
Processor ARK ID123544
Intel TSX-NI version1.00
Processor package size76.0 x 56.5 mm
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Weight and Dimensions IconWeight and Dimensions
Depth551.2 mm
Width215.9 mm
Height444.5 mm
Weight22400 g

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