HP Z8 G4 Maintenance And Service Guide

Heat sink
NOTE: The heat sink spare part kit includes replacement thermal material.
Follow these steps to remove the heat sink:
NOTE: When replacing the heat sink, be sure that the processor (see Processor on page 35) is removed from
the defective heat sink and installed on the replacement heat sink.
1. Prepare the computer for disassembly (see Preparation for disassembly on page 17).
2. Remove the access panel (see Access panel on page 22).
3. Remove the interior upper cover and interior lower cover (see Interior covers on page 24).
4. Disconnect the heat sink fan cable (1) from the system board.
CAUTION: The heat sink captive screws must be loosened and tightened in the sequence indicated on the
label on the heat sink. Failure to follow this sequence can result in damage to the heat sink, the processor,
and the system board.
5. In the sequence indicated on the label on the heat sink, loosen the four slotted Torx30 captive screws (2)
that secure the heat sink to the computer.
CAUTION: The processor is attached to the bottom of the heat sink. When the heat sink is removed, it is
recommended that the heat sink be left resting upside down, with the processor resting on top of the heat
sink. Failure to follow this caution can result in damage to the processor.
6. Remove the heat sink (3).
Reverse this procedure to install the heat sink.
34 Chapter 4 Removal and replacement procedures

HP Z8 G4 Specifications

General

Display included	No
Keyboard included	Yes
Power supply	1125 W
Operating system architecture	64-bit
Audio chip	Realtek ALC221
Product type	Workstation
Market positioning	Business
Motherboard chipset	Intel C622
Chassis type	Tower
Product color	Black
Country of origin	China
Number of 3.5\" bays	4
Number of 5.25\" bays	2
PCI Express x8 slots	3
Headphone outputs	1
HDMI ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	8
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	-
Total storage capacity	1000 GB
Memory slots	24x DIMM
Internal memory	8 GB
Memory channels	Hepta-channel
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 8 GB
Tcase	77 °C
Stepping	U0
Processor cache	11 MB
Processor model	4108
System bus rate	- GT/s
Processor socket	LGA 3647 (Socket P)
Processor threads	16
Processor codename	Skylake
Processor frequency	1.8 GHz
Processor cache type	L3
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3 GHz
Thermal Design Power (TDP)	85 W
Maximum number of PCI Express lanes	48
Memory clock speeds supported by processor	2400 MHz
Maximum internal memory supported by processor	768 GB
Scalability	2S
Processor code	SR3GJ
Processor ARK ID	123544
Intel TSX-NI version	1.00
Processor package size	76.0 x 56.5 mm
Supported instruction sets	AVX, AVX 2.0, AVX-512, SSE4.2

Weight and Dimensions

Depth	551.2 mm
Width	215.9 mm
Height	444.5 mm
Weight	22400 g