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HP Z8 G4 Maintenance And Service Guide

HP Z8 G4
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System board
NOTE: The system board spare part kit includes replacement thermal material.
Follow these steps to remove the system board:
1. Prepare the computer for disassembly (see Preparation for disassembly on page 17), and then remove the
following components:
a. Access panel (see Access panel on page 22)
b. Interior upper cover and interior lower cover (see Interior covers on page 24)
c. Rear fan (see Rear fan on page 25)
d. Internal PCIe bracket (see Internal PCIe bracket on page 27)
e. Memory fan (see Memory fan on page 28)
f. Front card guide and fans (see Front card guide and fans on page 31)
NOTE: When replacing the system board, be sure that the heat sink (see Heat sink on page 34) is
removed from the defective system board and installed on the replacement system board.
2. Disconnect the following cables from the system board:
(1) Power supply P3 cable
(2) Front audio cable
(3) Power supply P2 cable
(4) Power supply P4 cable
(5) USB cable
(6) FUI cable
(7) Power supply P1 cable
(8) Drive SATA cables (up to 8 locations)
32 Chapter 4 Removal and replacement procedures

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HP Z8 G4 Specifications

General IconGeneral
Display includedNo
Keyboard includedYes
Power supply1125 W
Operating system architecture64-bit
Audio chipRealtek ALC221
Product typeWorkstation
Market positioningBusiness
Motherboard chipsetIntel C622
Chassis typeTower
Product colorBlack
Country of originChina
Number of 3.5\" bays4
Number of 5.25\" bays2
PCI Express x8 slots3
Headphone outputs1
HDMI ports quantity0
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity8
Cabling technology10/100/1000Base-T(X)
Ethernet LAN data rates10, 100, 1000 Mbit/s
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integrated-
Total storage capacity1000 GB
Memory slots24x DIMM
Internal memory8 GB
Memory channelsHepta-channel
Memory clock speed2666 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory- GB
Memory layout (slots x size)1 x 8 GB
Tcase77 °C
SteppingU0
Processor cache11 MB
Processor model4108
System bus rate- GT/s
Processor socketLGA 3647 (Socket P)
Processor threads16
Processor codenameSkylake
Processor frequency1.8 GHz
Processor cache typeL3
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3 GHz
Thermal Design Power (TDP)85 W
Maximum number of PCI Express lanes48
Memory clock speeds supported by processor2400 MHz
Maximum internal memory supported by processor768 GB
Scalability2S
Processor codeSR3GJ
Processor ARK ID123544
Intel TSX-NI version1.00
Processor package size76.0 x 56.5 mm
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Weight and Dimensions IconWeight and Dimensions
Depth551.2 mm
Width215.9 mm
Height444.5 mm
Weight22400 g

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