HP Z8 G4 Maintenance And Service Guide

Processor
NOTE: The processor spare park kit includes replacement thermal material.
Follow these steps to remove the processor:
1. Prepare the computer for disassembly (see Preparation for disassembly on page 17), and then remove the
following components:
a. Access panel (see Access panel on page 22)
b. Interior upper cover and interior lower cover (see Interior covers on page 24)
c. Heat sink (see Heat sink on page 34)
2. Turn the heat sink upside down with the heat sink fan toward you.
3. Release the four clips (1) that secure the processor holder to the heat sink.
4. Remove the processor holder (2) from the heat sink by lifting it straight up.
5. Carefully release the processor holder clips (3).
6. Remove the processor (4) from the processor holder by lifting it straight up.
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the processor (1) and the heat
sink (2) and reinstalled each time the processor is removed. Replacement thermal material is included with the
processor and heat sink spare part kits.
Processor 35

HP Z8 G4 Specifications

General

Display included	No
Keyboard included	Yes
Power supply	1125 W
Operating system architecture	64-bit
Audio chip	Realtek ALC221
Product type	Workstation
Market positioning	Business
Motherboard chipset	Intel C622
Chassis type	Tower
Product color	Black
Country of origin	China
Number of 3.5\" bays	4
Number of 5.25\" bays	2
PCI Express x8 slots	3
Headphone outputs	1
HDMI ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	8
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	-
Total storage capacity	1000 GB
Memory slots	24x DIMM
Internal memory	8 GB
Memory channels	Hepta-channel
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 8 GB
Tcase	77 °C
Stepping	U0
Processor cache	11 MB
Processor model	4108
System bus rate	- GT/s
Processor socket	LGA 3647 (Socket P)
Processor threads	16
Processor codename	Skylake
Processor frequency	1.8 GHz
Processor cache type	L3
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3 GHz
Thermal Design Power (TDP)	85 W
Maximum number of PCI Express lanes	48
Memory clock speeds supported by processor	2400 MHz
Maximum internal memory supported by processor	768 GB
Scalability	2S
Processor code	SR3GJ
Processor ARK ID	123544
Intel TSX-NI version	1.00
Processor package size	76.0 x 56.5 mm
Supported instruction sets	AVX, AVX 2.0, AVX-512, SSE4.2

Weight and Dimensions

Depth	551.2 mm
Width	215.9 mm
Height	444.5 mm
Weight	22400 g