HP Z8 G4 Maintenance And Service Guide

Control panel message Description Recommended action
00E-Inventory Error during MEBx Execution BIOS information passed to the MEBx resulted in
a failure.
1. Reboot the computer.
2. If the error persists, update to the latest
BIOS version.
3. If the error still persists, replace the system
board.
00F-Interface Error during MEBx Execution MEBx operation experienced a hardware error
during communication with the ME.
1. Reboot the computer.
2. If the error persists, update to the latest
BIOS version.
3. If the error still persists, replace the system
board.
100-Front Audio Not Connected Front audio cable has been detached or
unseated from system board.
Reconnect or replace front audio cable.
2E1-MemorySize Error Memory amount has changed since the last boot
(memory added or removed).
The system memory size is dierent from
the last startup. The most common reason is
the removal of memory from the system board.
Press the F1 key to save the memory changes. If
this message persists, verify that the memory
modules are installed correctly.
2E2-Memory Error Memory module conguration failed during boot
up.
1. Ensure memory modules are correctly
installed.
2. Verify proper memory module type.
3. Remove and replace the identied faulty
memory module(s).
4. If the error persists after replacing memory
modules, replace the system board.
2E3-Incompatible Memory Module in Memory
Socket(s) X, X, ...
A memory module in memory socket identied in
the error message is missing critical SPD
information, or is incompatible with the chipset.
1. Verify proper memory module type.
2. Try another memory socket.
3. Replace with a supported module.
2E4-DIMM Conguration Warning The current memory conguration is not
optimized.
Rearrange the DIMMs so that each channel has
the same amount of memory.
2E5-ECC Memory Module Detected on
Unsupported Platform
Recently added memory module(s) support ECC
memory error correction.
1. If additional memory was recently added,
remove it to see if the problem remains.
2. Check product documentation for memory
support information.
2E6–Memory Not Congured Correctly for Proper
MEBx Execution
DIMM1 is not installed. Make sure there is a memory module in
the DIMM1 socket and that it is properly seated.
300–Conguration Change Warning The storage device conguration will be updated
as shown.
Not applicable
301-Hard Disk 1: SMART Hard Drive Detects
Imminent Failure
Hard drive is about to fail. (Some hard drives
have a hard drive rmware patch that will x an
erroneous error message.)
1. Determine if hard drive is giving correct
error message. Run the Drive Protection
System test under using F2 Diagnostics
when booting the computer.
2. Apply hard drive rmware patch
if applicable. (Available at
http://www.hp.com/support.)
3. Back up contents and replace hard drive.
POST numeric codes and text messages 75

HP Z8 G4 Specifications

General

Display included	No
Keyboard included	Yes
Power supply	1125 W
Operating system architecture	64-bit
Audio chip	Realtek ALC221
Product type	Workstation
Market positioning	Business
Motherboard chipset	Intel C622
Chassis type	Tower
Product color	Black
Country of origin	China
Number of 3.5\" bays	4
Number of 5.25\" bays	2
PCI Express x8 slots	3
Headphone outputs	1
HDMI ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	8
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	-
Total storage capacity	1000 GB
Memory slots	24x DIMM
Internal memory	8 GB
Memory channels	Hepta-channel
Memory clock speed	2666 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	- GB
Memory layout (slots x size)	1 x 8 GB
Tcase	77 °C
Stepping	U0
Processor cache	11 MB
Processor model	4108
System bus rate	- GT/s
Processor socket	LGA 3647 (Socket P)
Processor threads	16
Processor codename	Skylake
Processor frequency	1.8 GHz
Processor cache type	L3
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3 GHz
Thermal Design Power (TDP)	85 W
Maximum number of PCI Express lanes	48
Memory clock speeds supported by processor	2400 MHz
Maximum internal memory supported by processor	768 GB
Scalability	2S
Processor code	SR3GJ
Processor ARK ID	123544
Intel TSX-NI version	1.00
Processor package size	76.0 x 56.5 mm
Supported instruction sets	AVX, AVX 2.0, AVX-512, SSE4.2

Weight and Dimensions

Depth	551.2 mm
Width	215.9 mm
Height	444.5 mm
Weight	22400 g