HPE ProLiant ML350

To replace the component, reverse the removal procedure.
For DIMM configuration information, see the server user guide.
System board
To remove the component:
Procedure
1. Do one of the following:
• For tower models, open and remove the tower bezel.
• For rack models, if installed, remove the security bezel.
2. Power down the server.
3. Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server .
4. Do one of the following:
• For tower models, place the server on a flat, level surface with the access panel facing up.
• For rack models, extend the server from the rack.
5. Remove the access panel.
6. Remove the air baffle.
7. Remove the fan cage.
8. Remove all DIMMs.
9. Disconnect all cables connected to the system board.
10. Remove all components on the failed system board.
11. Remove the heatsink:
a. Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws.
b. Completely loosen all screws in the same sequence.
c. Remove the heatsink from the processor backplate.
System board 51