Technical Reference
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Table 36 provides maximum case temperatures for the components that are sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to
cool the board.
Table 36. Thermal Considerations for Components
For processor case temperature, see processor datasheets and processor
specification updates
To ensure functionality and reliability, the component is specified for proper operation when
Case Temperature is maintained at or below the maximum temperature listed in Table 37. This is
a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified
as the maximum sustainable power to be dissipated by the components). When the component is
dissipating less than TDP, the case temperature should be below the Maximum Case
Temperature. The surface temperature at the geometric center of the component corresponds to
Case Temperature.
It is important to note that the temperature measurement in the system BIOS is a value reported
by embedded thermal sensors in the components and does not directly correspond to the
Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is
Tcontrol.
Table 37. Tcontrol Values for Components
Processor For processor case temperature, see processor datasheets and processor
specification updates
Processor datasheets and specification updates
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