Lenovo ThinkSystem SR860 V2 - Page 216

The following illustration shows the components of the PHM.
Figure 95. PHM components
1 Heat sink
9 Clips to secure processor in carrier
2 Heat sink triangular mark
10 Carrier triangular mark
3 Processor identification label
11 Processor ejector handle
4 Nut and wire bail retainer 12 Processor heat spreader
5 Torx T30 nut 13 Thermal grease
6 Anti-tilt wire bail 14 Processor contacts
7 Processor carrier 15 Processor triangular mark
8 Clips to secure carrier to heat sink
Procedure
Step 1. Make preparations for this task.
a. Remove the top cover. See
“Remove the top cover” on page 240.
b. Remove both PCIe riser cages or fillers, the chassis air baffle, and the PCIe expansion tray (see
“Remove a 4U PCIe riser cage” on page 255, “Remove the chassis air baffle” on page 270, and
“Remove the 4U PCIe expansion tray” on page 249).
c. Remove the following components depending on the location of the processor that is to be
removed:
• If the processor is located on the processor and memory expansion tray, do not remove the
expansion tray.
208 ThinkSystem SR860 V2 Maintenance Manual