Jetson AGX Xavier Series Product DG-09840-001_v2.5 | 137
Chapter 22. Design Guideline Glossary
The design guidelines include various terms. The following descriptions are intended to show
what these terms mean and how they should be applied to a design.
ï‚„ Trace Delay
• Max Breakout Delay
Routing on Component layer: Maximum Trace Delay from module connector pin to
point beyond pin array where normal trace spacing/impedance can be met. Routing
passes to layer other than Component layer: Beyond this, normal trace
spacing/impedance must be met.
• Max Total Trace Delay
Trace from module connector pin to device pin. This must include routing on the main
PCB and any other Flex or secondary PCB. Delay is from the module connector to the
final connector and device.
ï‚„ Intra and Inter Pair Skews
• Intra Pair Skew within Pair
Difference in delay between two traces in differential pair: Shorter routes may require
indirect path to equalize delays.
• Inter Pair Skew Pair-to-Pair
Difference between two (or possibly more) differential pairs.
ï‚„ Impedance and Spacing
ï‚„ Microstrip vs. Stripline
> Microstrip: Traces next to single reference plane.
> Stripline: Traces between two reference planes.
• Trace Impedance
Impedance of trace determined by width and height of trace, distance from reference
plane, and dielectric constant of PCB material. For differential traces, space between
pair of traces is also a factor.
• Board Trace Spacing and Spacing to other Nets
Minimum distance between two traces. Usually specified in terms of dielectric height
which is distance from trace to reference layers.
• Pair to Pair Spacing
Spacing between differential traces.
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