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Jetson AGX Xavier Series Product DG-09840-001_v2.5 | 67
Parameter Requirement Units Notes
85Ω can be used if eDP/DP only and is
preferable as it can provide better trace loss
characteristic performance. See Note 1.
Reference Plane
Trace Length, Spacing and Skew
Trace loss characteristic @ 2.7GHz < 0.81 dB/in
The following max length is derived based on
this characteristic. The length constraint
must be re-defined if loss characteristic is
changed.
Max PCB Via dist. from module conn.
No requirement
7.63 (0.3)
mm (in)
Max trace length from module to connector
(Stripline / Microstrip)
(Stripline)
(Microstrip, 5x / 7x)
215 (1137.5)/(975)
101.6 (700)
89 (525) / 101.6
(600)
mm (ps)
6.9ps/mm assumption for Stripline, 5.9ps/mm
for Microstrip.
Trace spacing (Pair-Pair)
Stripline
Microstrip (
)
Microstrip (
)
3x
4x
5x to 7x
dielectric
Trace spacing (Main Link to AUX):
Stripline/Microstrip
3x / 5x dielectric
Max Intra-pair (within pair) Skew 0.15 (1) mm (ps)
Do not perform length matching within
breakout region
Do trace length matching before hitting
discontinuity (i.e. matching to <1ps before the
vias or any discontinuity to minimize common
mode conversion).
Max Inter-pair (pair-pair) Skew 150 ps
Max GND transition Via distance < 1x diff pair pitch
For signals switching reference layers, add
symmetrical GND stitching Via near signal
Vias.
Impedance dip
Recommended via dimension for impedance
control
Drill/Pad
Antipad
Via pitch
≥97
≥92
200/400
>840
≥880
Ω @ 200ps
Ω @ 35ps
um
um
um
The via dimension must be required for the
HDMI-DP co-layout condition.
Topology Y-pattern is recommended
keep symmetry
Xtalk suppression is best using the
Y-pattern. It can also reduce the
limit of pair-pair distance.
For in-line via, the distance from a
via of one lane to the adjacent via
from other lane >= 1.2 mm center-
center.
GND via
Place GND via as symmetrically as
possible to data pair vias. Up to 4
GND via is used to maintain return path, while
its Xtalk suppression is limited
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