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Jetson AGX Xavier Series Product DG-09840-001_v2.5 | 68
Parameter Requirement Units Notes
signal vias (2 diff pairs) can share a
single GND return via
Max # of Vias
PTH vias
Micro Vias
4 if all vias are PTH via
Not limited as long as total channel
loss meets IL spec
Max Via Stub Length 0.4 mm
Value 0.1 uF Discrete 0402
Max Dist. from AC cap to connector
No requirement
0.5
in
Voiding
No requirement
Voiding required
: Voiding the plane directly under the
pad 3-4 mils larger than the pad size is
recommended.
Serpentine (See USB 3.1 Guidelines)
Voiding
RBR/HBR
HBR2
No requirement
Voiding required
HBR2: Standard DP Connector: Voiding
requirement is stack-up dependent. For
typical stack-ups, voiding on the layer under
the connector pad is required to be 5.7mil
larger than the connector pad.
Keep critical PCIe traces such as PEX_TX/RX, TERMP etc. away from other signal traces or unrelated power traces/areas or power
supply components
Notes:
1. For eDP/DP, the spec puts a higher priority on the trace loss characteristic than on the impedance. However, before
selecting 85Ω for impedance, it is important to make sure the selected stack-up, material and trace dimension can achieve
the needed low loss characteristic.
2. The average of the differential signals is used for length matching.
3. Do not perform length matching within breakout region. Recommend doing trace length matching to <1ps before vias or any
discontinuity to minimize common mode conversion
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