Penguin Computing Relion 1900e - 3 Processor Support; Processor Socket Assembly; Figure 7. Processor Socket Assembly; Figure 8. LGA2011-3 ILM (Narrow)

Relion 1900e/2900e Manual
Revision 1.0 14
3. Processor Support
The server board includes two Socket-R3 (LGA2011-3) processor sockets and can support one or two of the
following processors:
 Intel
®
Xeon
®
processor E5-2600 v3, v4 product family
 Supported Thermal Design Power (TDP) of up to 145W.
Note: P
revious generation Intel
®
Xeon
®
processors are not supported on the Intel server boards described in
this document.
3.1 Processor Socket Assembly
Each processor socket of the server board is pre-assembled with an Independent Latching Mechanism (ILM)
and Back Plate which allow for secure placement of the processor and processor heat sink to the server
board.
The ill
ustration below identifies each sub-assembly component:
Figure 7.
Processor Socket Assembly
Figure 8. LGA2011-3 ILM (Narrow)
94 mm
56 mm