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Edition 6-1
6. Build Styles and Dimensions
Build Styles
The PowerPact6 family is available in Radstone’s five electrically compatible build levels. These have
two basic mechanical configurations:
¾ Air (convection)-cooled (build levels 1 to 3) in accordance with PICMG 2.0 R3.0 specification,
designed to be used in standard industrial chassis
¾ Conduction-cooled (build levels 4 and 5) in accordance with ANSI/VITA 30.1-2002 – 2mm
Connector Equipment Practice for Conduction-Cooled Eurocards, for use in sealed ATR chassis
and other conduction-cooled environments
In addition to these COTS configurations, PowerPact6 processors may be supplied to meet the
mechanical and thermal requirements of specific platforms with the addition of mission specific, to-type
mechanics.
Radstone uses advanced thermal and mechanical design in the PCB, metal work and assembly process to
build-in the required levels of ruggedness. Build level 2 and higher circuit card assemblies include
conformal coating as standard.
All five styles fully support the power and versatility of the CompactPCI bus, so no matter how large or
diversified your project, absolute compatibility is assured at all stages of development.
A brief description of each build style follows:
Level 1
Intended for use in benign environments, level 1 also provides the ideal cost effective method of
complete system development. The level 1 assembly comprises a Eurocard size printed wiring board
with high quality commercial (plastic encapsulated) components.
As software compatibility throughout the build styles is absolute, a system intended for final
implementation in a severe tactical environment can be developed and debugged at low cost, switching
over to target style only in the final stages of system integration.
Level 2
As level 1, but tested in manufacture to provide an extended operating range.
Level 3
Level 3 boards are intended for applications that have extended temperature, shock and vibration
requirements, but can be served by conventional, forced-air cooled, racking systems. These rugged
boards comprise a Eurocard size printed wiring board fitted with wide temperature range components.
Level 4
The level 4 board features wide temperature range devices and an integral thermal management layer. It
also incorporates a central stiffening bar for additional strength.
Cooling is achieved through conduction of heat from the thermal management layer to the cold wall of
the rack to which the boards are secured by screw driven wedgelocks. Level 4 boards are temperature
characterized during manufacture.
Level 5
As level 4, but tested in manufacture to provide an extended operating range.
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