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Edition 1-2
Input/Output Capability
The PowerPact6 processor provides high-density rear I/O for systems requiring sealed box operation and
simple card replacement routines for field maintenance. Using rear I/O minimizes the effort required to
remove boards from a rack, so improving maintainability and reliability.
The PowerPact6 processors use 6-row CompactPCI J1, J2, J3, J4 and J5 connectors. PowerPact6
processor rear I/O connectivity, via the J3, J4 and J5 connectors, includes Ethernet, serial, GPIO and
access to the on-board PMC and AFIX sites. Front I/O connectivity (only available on build levels 1 to 3)
includes serial and USB, plus access to the on-board PMC sites.
To maximize the flexibility of connecting to the rear I/O, backplane modules and a range of breakout
panels are available (see below).
Figure 1-1. PowerPact6 I/O
I/O Modules
For use in chassis, Radstone offers backplane modules to convert the condensed J3/J4/J5 pinouts to
industry-standard formats, plus 3U breakout panels offering a variety of industry standard connectors
such as serial I/O. Internal cables and a basic set of external cables are available. These backplane
modules and breakout panels are intended for development use in a benign environment, and so are only
available in level 1 or 2 build standards.
For more details see the I/O Modules Manual, publication number RT5154.
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