Telit Wireless Solutions ME910G1 - Solder Paste; Solder Reflow

ME910G1 Hardware Design Guide
1VV0301593 Rev.12 Page 70 of 93 2021-09-24
Not Subject to NDA
Solder Paste
Various types and grades of solder paste can be used for surface mounting Telit modules.
For leadfree applications, a Sn-Ag (SA) or Sn-Ag-Cu (SAC) solder paste can be used. Any
Type 3 solder paste either water-soluble or no clean is acceptable.
We recommend using only “no clean” solder paste to avoid cleaning the modules after
assembly.
Solder Reflow
Recommended solder reflow profile:
Figure 30: Recommended solder reflow profile
Profile Feature
Pb-Free Assembly Free
Average ramp-up rate (T
L
to T
P
)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature
8 minutes max.
Table 36: Profile feature recommendations