ME910G1 Hardware Design Guide
1VV0301593 Rev.12 Page 71 of 93 2021-09-24
Note: All temperatures refer to topside of the package, measured on
the package body surface
Warning: THE ME910G1 MODULE WITHSTANDS ONE REFLOW
PROCESS ONLY.
Warning: The above solder reflow profile represents the typical SAC
reflow limits. It does not guarantee the proper adherence of the
module to the customer’s application throughout the temperature
range. The customer must optimize the reflow profile based on the
overall system considering such factors as thermal mass and
warpage.
Inspection
An inspection of the solder joint between the solder pads of the Telit module and the
application PCB should be performed. The best visual inspection tool for Telit module
solder joints inspection on PCB is X-ray transmission, which can identify defects such as
solder bridging, shorts, openings and large voids (Note: the small voids in large solder
joints are not detrimental to the reliability of the solder joint).
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