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Topcon MC-4S User Manual

Topcon MC-4S
76 pages
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USER MANUAL
MIRROR CHART
MC-4S

Table of Contents

Questions and Answers:

Topcon MC-4S Specifications

General IconGeneral
TypeAuto Refractometer / Keratometer
Measurement Steps (Refraction)0.01/0.12/0.25D
Measurement Steps (Keratometry)0.01D
DisplayLCD
Power SupplyAC100~240V, 50/60Hz
Measurement Range (Refraction)-25D to +25D (Sphere), -12D to +12D (Cylinder)
Pupil Diameter Measurement Range2.0 ~ 8.5mm

Summary

INTRODUCTION AND SAFETY

INTRODUCTION

Provides an overview of the TOPCON Mirror Chart MC-4S and its purpose.

GENERAL SAFETY INFORMATION

Crucial warnings and cautions for preventing electric shock, fire, and ensuring safe operation of the instrument.

INSTRUMENT OVERVIEW AND SETUP

DISPLAYS AND SYMBOLS FOR SAFE USE

Explains safety indicators, symbols, and their meanings for proper instrument handling.

NOMENCLATURE

Identifies and describes the main parts, ports, and indicators of the MC-4S and its accessories.

PREPARATION BEFORE USE

Guides on installing, connecting, powering up, and initial configuration of the MC-4S.

MC-4S CHART FUNCTIONS AND OPERATION

UNIQUE CHART FUNCTIONS

Details advanced visual acuity chart features like reversal, contrast, and simulation modes for enhanced testing.

IMAGE/MOVIE DISPLAY AND CUSTOMIZATION

Instructions for displaying and managing still images, movies, and slideshows, including user content.

SETTING THE VISUAL ACUITY CHART

Procedures for configuring examination distance, slideshow intervals, and other chart display parameters.

MAINTENANCE AND TROUBLESHOOTING

ROUTINE MAINTENANCE

Covers daily checks, cleaning procedures for the chart window and monitor, and battery replacement.

TROUBLE SHOOTING GUIDE

Provides solutions for common problems, error messages, and troubleshooting steps.

TECHNICAL SPECIFICATIONS AND GENERAL INFORMATION

SPECIFICATIONS & PERFORMANCE

Lists detailed technical specifications, performance metrics, and electrical ratings of the MC-4S.

USAGE, ENVIRONMENT, AND COMPLIANCE

Covers purpose, environmental conditions, storage, EMC, and external device requirements.

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