TYAN S7050 - Page 47

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47
Intel
®
Xeon
®
processor E5-2600/4600 product families UDIMM Support
1.35V 1.50V Ranks Per DIMM &
Data Width
Memory Capacity per DIMM
1DPC 2DPC 1DPC 2DPC
SRx8 Non-ECC 1 GB 2GB 4GB N/A N/A
1066,
1333
1066,
1333
DRx8 Non-ECC 2GB 4GB 8GB N/A N/A
1066,
1333
1066,
1333
SRx16 Non-ECC 512 MB 1GB 2GB N/A N/A
1066,
1333
1066,
1333
SRx8 ECC 1GB 2GB 4GB 1066 1066
1066,
1333
1066,
1333
DRx8 ECC 2GB 4GB 8GB 1066 1066
1066,
1333
1066,
1333
NOTE 1: The blue blocks indicate that the DRAM Densities are supported but not validated.
NOTE 2: The grey blocks indicate that the DRAM Densities are supported and validated.
NOTE 3: 1DPC => One dimm per channel
NOTE 4: 2DPC => Two dimm per channel
z Supported DRAM Densities are 1Gb, 2Gb and 4Gb. Only 2Gb and 4Gb are validated
by Intel.
z Command Address Timing is 1N for 1DPC and 2N for 2DPC.
z Romley-EP/EX platform does not support 3DPC when using UDIMMs.
Intel
®
Xeon
®
processor E5-2600/4600 product families LRDIMM Support
1.35V 1.50V Ranks Per DIMM &
Data Width
Memory Capacity per
DIMM
1DPC 2DPC 1DPC 2DPC
QRx4 (DDP) 16GB 32GB 1066 1066
1066,
1333
1066,
1333
QRx8 (P) 8GB 16GB 1066 1066
1066,
1333
1066,
1333
NOTE: The blue blocks indicate that the DRAM Densities are supported and not validated.
z Physical Rank is used to calculate DIMM Capacity.
z Supported and validated DRAM Densities are 2Gb and 4Gb.
z Command Address Timing is 1N.
z The speeds are estimated targets and will be verified through simulation.
z For 3SPC/3DPC -Rank Multiplication (RM) >= 2.
z DDP -Dual Die Package DRAM stacking. P –Planer monolithic DRAM Die.
z Romley-EP/EX platform does not support 3DPC when using E5-2400 LRDIMMs.