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C5 Series User Manual Rev. 1.4
Temperature Range (Operation/Storage)
Housing temperature during operation: 0 °C to +50 °C (+32 °F to +122 °F)
Sensor chip temperature (on-board)
during operation: 0 °C to +65 °C (+32 °F to +149 °F)
Humidity during operation: 20 % to 80 %, relative, non-condensing
Storage temperature: -20 °C to +80 °C (-4 °F to +176 °F)
Storage humidity: 20 % to 80 %, relative, non-condensing
Heat Dissipation
The operation of the C5 camera requires sufficient heat dissipation. Depending on the
environmental conditions the sensor housing may not provide a sufficient cooling surface
to dissipate the thermal power loss, which is generated by the core electronics and the
sensor chip.
All 3D cameras of the C5 series feature high-speed CMOS sensor chips. A typical property
of a CMOS sensor is that it provides best image quality by low temperatures. High
temperatures will lead to an increase of dark current, noise and hence to a reduction of
signal-to-noise ratio (SNR).
To eliminate these effects it is often sufficient to mount the C5 sensor on a heat
conductive material, such as a metal surface.
In case that it is not possible to mount the camera on any heat dissipating
carrier, then it is recommended to use a heat sink with the required
specification of AT.
General Guidelines for Heat Dissipation
- Mount the 3D camera to a heat conductive material with an absolute thermal
resistance of at least 6 K / W.
- Always monitor the temperature of the sensor (on-board, available over
GenICam) and make sure that the temperature does not exceed 65 °C.
- Keep in mind that dark current and noise performance for CMOS sensor will
degrade at higher temperature.
- The 3D camera of the C5 series will gradually become warmer during the first hour
of operation. After one hour of operation, the housing temperature as well as the
sensor temperature should be stable and no longer increase.
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