IBM System x3100 M4 Problem Determination And Service Guide

5. Remove the air duct.
6. Remove the heat sink from the microprocessor:
Attention: The heat sink may become very hot during normal operation.
Allow time for the heat sink to cool down before you touch it.
a. Loosen the screws and alternate among the screws until they break the
seal with the microprocessor.
b. Press firmly on the captive screws and loosen them with a screwdriver.
c. Use your fingers to gently pull the heat sink from the microprocessor.
Important: Be careful when you handle the microprocessor and heat sink.
If the microprocessor and heat sink will be reused, do not contaminate the
thermal material between them.
Heat sink
System board
Attention: The microprocessor retention latch is spring-loaded when the
microprocessor is in place. Releasing the latch too quickly or allowing it to
spring upward can damage the microprocessor and surrounding components.
7. Release the microprocessor retention latch by pressing down on the end,
moving it to the side, and slowly releasing it to the open (up) position.
Chapter 5. Removing and replacing server components 251

IBM System x3100 M4 Specifications

General

Memory	Up to 32 GB DDR3 ECC UDIMM
Memory Slots	4 DIMM slots
Form Factor	Tower
Chipset	Intel C202
Processor Sockets	1
Processor	Intel Xeon E3-1200 v2 series, Intel Pentium series, Intel Celeron series
Storage	Up to 4x 3.5-inch
Power Supply	350W
Hard Drive Bays	4 x 3.5"
RAID Support	RAID 0, 1, 10
Network Interface	Gigabit Ethernet
Expansion Slots	1 x PCIe 3.0 x16, 1 x PCIe 2.0 x4
Operating System Support	Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server