3. Use the cleaning pad to wipe the thermal grease from the bottom of the heat
sink.
Note: Make sure that all of the thermal grease is removed.
4. Use a clean area of the cleaning pad to wipe the thermal grease from the
microprocessor; then, dispose of the cleaning pad after all of the thermal grease
is removed.
Microprocessor
0.02 mL of thermal
grease
5. Use the thermal-grease syringe to place 9 uniformly spaced dots of 0.02 mL
each on the top of the microprocessor. The outermost dots must be within
approximately 5 mm of the edge of the microprocessor, this is to ensure uniform
distribution of the grease.
Note: If the grease is properly applied, approximately half of the grease will
remain in the syringe.
6. Install the heat sink onto the microprocessor as described in “Installing a
microprocessor and heat sink” on page 254.
Removing the system board
To remove the system board on 4U server models with non-hot-swap power
supplies, complete the following steps. For the 5U server model with hot-swap
power supplies (Model name: 2582-F4x), please see the next sub-section.
1. Read the safety information that begins on page vii and “Installation guidelines”
on page 163.
2. Turn off the server and all attached devices; then, disconnect all power cords
and external cables.
3. Carefully turn the server on its side so that it is lying flat, with the cover facing
up.
Attention: Do not allow the server to fall over.
4. Remove the side cover (see “Removing the side cover” on page 166).
5. Remove the air duct.
6. Remove the microprocessor and heat sink (see “Removing the microprocessor
and heat sink” on page 250).
Attention: Remove the socket covers from the microprocessor sockets on
the new system board and place them on the microprocessor sockets of the
system board you are removing.
7. Pull the drive cage half out of the chassis.
258 IBM System x3100 M4 Type 2582: Problem Determination and Service Guide
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