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Intel 3210 User Manual

Intel 3210
58 pages
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Reference Number: 318465 Revision: 001
Intel
®
3210 and 3200 Chipset
Thermal/Mechanical Design Guide
November 2007

Table of Contents

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Intel 3210 Specifications

General IconGeneral
ChipsetIntel 3210
Max Memory8 GB
Expansion Slots1 x PCIe x16, 2 x PCIe x1, 3 x PCI
Form FactorATX
Supported ProcessorsIntel Core 2 Duo
Memory Slots4
Storage Interfaces4 x SATA 3.0 Gb/s

Summary

Chipset Packaging Technology Details

Package Mechanical Handling Requirements

Specifies mechanical load limits and handling for the chipset package.

Thermal Specifications for Chipsets

Chipset Thermal Design Power (TDP)

Specifies the target power level for thermal solution design.

Chipset Operating Temperature Specifications

Defines maximum/minimum operating temperature ranges for reliability.

Chipset Thermal Simulation Guidelines

Thermal Metrology and Measurement

MCH Case Temperature Measurement Procedures

Procedures for accurately measuring MCH IHS temperatures.

Supporting Test Equipment for Metrology

Lists recommended equipment for thermocouple attachment.

Thermocouple Attachment Procedure Steps

Detailed steps for attaching a thermocouple to the IHS.

Reference Thermal Solution Design

Thermal Solution Assembly Process

Describes the assembly of the passive heatsink solution.

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