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Specifies mechanical load limits and handling for the chipset package.
Specifies the target power level for thermal solution design.
Defines maximum/minimum operating temperature ranges for reliability.
Procedures for accurately measuring MCH IHS temperatures.
Lists recommended equipment for thermocouple attachment.
Detailed steps for attaching a thermocouple to the IHS.
Describes the assembly of the passive heatsink solution.
General| Chipset | Intel 3210 |
|---|---|
| Max Memory | 8 GB |
| Expansion Slots | 1 x PCIe x16, 2 x PCIe x1, 3 x PCI |
| Form Factor | ATX |
| Supported Processors | Intel Core 2 Duo |
| Memory Slots | 4 |
| Storage Interfaces | 4 x SATA 3.0 Gb/s |
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