Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 37
Reference Thermal Solution
6.4.1 Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the chipset MCH.
Figure 6-3 shows the heatsink profile. Other heatsinks with similar dimensions and
increased thermal performance may be available. A full mechanical drawing of this
heatsink is provided in Appendix B.
Figure 6-2. Design Concept for Reference Thermal Solution
Figure 6-3. Heatsink Extrusion Profiles
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