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Intel 3210 User Manual
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Intel® 3210 and 3200 Chipset Therma
l/Mechanical Design Guide
43
Thermal Solution Component Suppliers
A
Thermal Solution Component
Suppliers
A.1
Heatsink Thermal Solution
§
Part
Intel Pa
rt
Number
Quantity
Contact Information
Heatsink Assembly
D96730-001
Monika Chih
monika_chih@ccic.com.t
w
886-2-29952666-1131
Heatsink
D96729-001
1
Retainer
D92698-001
1
Nuts-Inserts
D92621-001
4
Bracket
E11663-001
1
Stiffener-backplate
D94244-00
1
1
42
44
Table of Contents
Default Chapter
3
Table of Contents
3
1 Introduction
7
Design Flow
8
Definition of Terms
8
Thermal Design Process
8
Reference Documents
9
2 Packaging Technology
11
MCH Package Dimensions (Top View)
11
MCH Package Height
11
MCH Package Dimensions (Bottom View)
12
Non-Critical to Function Solder Joints
13
Package Mechanical Requirements
13
Package Height
14
3 Thermal Specifications
15
Thermal Design Power (TDP)
15
Thermal Specification
15
4 Thermal Simulation
17
5 Thermal Metrology
19
MCH Case Measurement
19
Supporting Test Equipment
19
Thermocouple Attach Support Equipment
19
Thermal Calibration and Controls
20
IHS Groove
20
Omega Thermocouple
20
FCBGA7 Chipset Package Reference Groove Drawing
21
IHS Groove on the FCBGA7 Chipset Package on the Live Board
21
Thermocouple Attach Procedure
22
The Live Board on the Fixture Plate
22
Inspection of Insulation on Thermocouple
23
Bending the Tip of the Thermocouple
23
Extending Slightly the Exposed Wire over the End of Groove
24
Securing Thermocouple Wire with Kapton* Tape Prior to Attach
24
Detailed Thermocouple Bead Placement
25
Placing Thermocouple Bead into the Bottom of the Groove
26
Measuring Resistance between Thermocouple and IHS
27
Cutting Solder
28
Solder Block Setup
29
Observing the Solder Melting
30
Remove Excess Solder
31
Remove Excess Solder
32
Thermocouple Placed into Groove
32
Fill Groove with Adhesive
33
Finished Thermocouple Installation
34
6 Reference Thermal Solution
35
Operating Environment
35
Heatsink Performance
35
Mechanical Design Envelope
36
Thermal Solution Assembly
36
Reference Heatsink Measured Thermal Performance Vs. Approach Velocity
36
Extruded Heatsink Profiles
37
Design Concept for Reference Thermal Solution
37
Heatsink Extrusion Profiles
37
Retention Mechanism Responding in Shock and Vibration
38
Thermal Interface Material
38
Honeywell PCM45F* TIM Performance as a Function of Attach Pressure
38
Reference Thermal Solution Assembly Process
39
Reference Thermal Solution Assembly Process - Heatsink Sub-Assembly (Step 1)
39
Reliability Guidelines
40
Reference Thermal Solution Assembly Process - Heatsink Assembly (Step 2)
40
Reference Thermal Solution Environmental Reliability Guidelines
41
A Thermal Solution Component Suppliers
43
Heatsink Thermal Solution
43
B Mechanical Drawings
45
Intel® 3210 and 3200 Chipset Package Drawing
45
Intel® 3210 and 3200 Chipset Motherboard Component Top-Side Keep-Out Restrictions
45
Intel® 3210 and 3200 Chipset Motherboard Component Back-Side Keep-Out Restrictions
45
Intel® 3210 and 3200 Chipset Reference Thermal Solution Assembly
45
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Heatsink Drawing
45
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Spring Preload Clip
45
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Fastener Nut
45
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (1 of 2)
45
Intel® 3210 and 3200 Chipset Reference Thermal Solution - Bracket (2 of 2)
45
B-1 Intel® 3210 and 3200 Chipset Package Drawing
46
B-2 Intel® 3210 and 3200 Chipset Motherboard Component Top-Side Keep-Out Restrictions
47
B-3 Intel® 3210 and 3200 Chipset Motherboard Component Back-Side Keep-Out Restrictions
48
B-4 Intel® 3210 and 3200 Chipset Reference Thermal Solution Assembly
49
B-5 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Heatsink Drawing
50
B-6 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Spring Preload Clip
51
B-7 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Fastener Nut
52
B-10 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Backplate Assembly
55
B-11 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Backplate
56
B-12 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Insulator
57
B-13 Intel® 3210 and 3200 Chipset Reference Thermal Solution - Flush Mount Stud
58
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Intel 3210 Specifications
General
Brand
Intel
Model
3210
Category
Motherboard
Language
English
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