Intel 3210 - FCBGA7 Chipset Package Reference Groove Drawing; IHS Groove on the FCBGA7 Chipset Package on the Live Board

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 21
Thermal Metrology
The orientation of the groove relative to the package pin 1 indicator (gold triangle in
one corner of the package) is shown in Figure 5-3 for the FCBGA7 chipset package IHS.
Figure 5-2. FCBGA7 Chipset Package Reference Groove Drawing
Figure 5-3. IHS Groove on the FCBGA7 Chipset Package on the Live Board