Intel 3210 User Manual

Intel® 3210 and 3200 Chipset Thermal/Mechanical Design Guide 55
Mechanical Drawings
Figure B-10. Intel
®
3210 and 3200 Chipset Reference Thermal Solution - Backplate
Assembly
8 7 6 5 4 3 2
H G F E D C B A
8 7 6 5 4 3 2 1
H G F E D C B A
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
- A INITIAL DV RELEASE 03/09/07 KJC
1 PRODUCTION RELEASE 06/20/07 KJC
D94244 1 1
DWG. NO SHT. REV
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
PST
TITLE
BONE TRAIL,MCH,STIFFENER,PLATE
SIZE DRAWING NUMBER REV
A1 D94244 1
SCALE:
2
DO NOT SCALE DRAWING
SHEET
1
OF
1
SEE NOTESSEE NOTES FINISHMATERIAL 03/12/07K.KOEPSELL DATEAPPROVED BY 03/12/07R.AOKI 03/12/07A.VALPIANI DATECHECKED BY 03/09/07K.CEURTER DATEDRAWN BY 03/09/07K.CEURTER DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS ± 0.1
ANGLES ±1
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBERITEM NOQTY
ASSY,STIFFENER,BD,BONE TRAILD94244-001TOP BONE TRAIL, MCH, STIFFENER, PLATED92620-00111
BONE TRAIL,STUD,SELF-CLINCHING, DOG POINTD92622-00124
BONE TRAIL,INSULATOR,BACK PLATED92624-00131
0.13
()2.127
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS 2. REMOVE OILS-GREASE FROM PLATE PRIOR TO INSULATOR (3) INSTALLATION.
3 INSTALL STUDS FLUSH TO THIS SURFACE +0.1 / -0.25 MM 4 INSULATOR WILL OVERHANG EDGE UPON PLACEMENT AND IS ACCEPTABLE
PLATE PUNCH/BURR DIRECTION
3
4
1
1
2
4
3
1

Intel 3210 Specifications

General

Brand	Intel
Model	3210
Category	Motherboard
Language	English